If your application can benefit from at least two of the three core siXis benefits — miniaturization, higher performance, lower power usage — your system is a good candidate for a customized embedded computing module.
For more information call 1-877-749-4770 or 1-919-248-4193 or email.
What are you looking for in a next-generation circuit board?
- Miniaturization – up to 60% smaller and lighter to reduce the overall size of my product.
Traditional embedded computing modules with FR-4 PCBs use packaged parts and have interconnect density and substrate size limitations. But through siXis’ SiCB technology, our modules bypass these limitations and allow for smaller hardware overall. Plus, siXis uses bare die and high-aspect-ratio (through silicon) vias to allow more functionality per unit volume. - Greener, consuming up to 30% less power.
Every siXis product is designed to use less energy for signal propagation resulting in overall reduced power consumption. - Higher performing, with faster compute speeds.
Our higher I/O density (10X signal paths) delivers more performance per unit volume to enable cutting-edge electronics. In addition, the silicon-to-silicon connections and short interconnect paths in our embedded computing modules have fewer parasitics, leading to higher performance. - More reliable — critical applications demand it.
Most failures on circuit boards occur due to the packaging of the electronic parts. Connecting bare silicon die to a silicon substrate eliminates the failures previously caused by the mismatch of the coefficient of thermal expansion between the FR-4 circuit board, the component package, and the silicon die.
