siXis, Inc. Introduces Next Generation Embedded Computing Modules
Semiconductor technology company introduces new line of embedded computing modules with custom variations
RESEARCH TRIANGLE PARK, NC – November 10, 2009 – siXis, Inc., pioneers of advanced Silicon Circuit Board (SiCB) technology, responded to broad industry demand for increased compute density and performance at lower power with a new line of embedded computing modules (ECM).
Currently the siXis product line includes two off-the-shelf high performance ECMs, the SXM100 and SXM220, and an evaluation tool, the SXM100 Development Board. Each of the modules takes advantage of siXis’ patent-pending SiCB technology, which combines bare-die and passive components on large-area silicon substrates. The company also offers custom variations including different CPUs, FPGAs, memory, and oscillators - all in significantly smaller packaging that uses up to 25% less power than traditional alternatives.
“These modules open up a new world of possibilities for advanced electronics manufacturers,” said John Goehrke, President and CEO of siXis. “Our approach delivers an alternative to expensive ASIC developments with unique performance and power advantages for integrating memory and logic.”
The SXM100 enhances a Xilinx Virtex-5 XC5VLX220T FPGA by integrating dual 1Gbit DDR2 memories, bypassed power distribution, and local oscillators in the same footprint as the FPGA. The SXM100 Development Board is an evaluation tool for the SXM100. It supports industry standard interfaces for networking, video, and system configuration and allows customers to evaluate the architecture of the SXM100.
The SXM220 significantly increases memory bandwidth and reduces power consumption by integrating an Altera Stratix IV FPGA and 8 Gbits of DDR3 memory, two local oscillators and bypassed power distribution.
“There are multiple, quantifiable advantages to our SiCB-based ECMs,” explained siXis Vice President of Engineering, David Blaker. “We flip-chip attach bare die devices to a large-area passive silicon substrate resulting in a subsystem that’s reduced in size by a factor of two to three. This provides the additional benefit of reducing the complexity of the underlying PCB while simultaneously lowering the module sub-system power dissipation on the order of 25%.”
The SXM100 Embedded Computing Module and SXM100 Development Board engineering samples are available with a delivery of eight to ten weeks ARO. Engineering samples of the SXM220 Embedded Computing Module will be available starting in June 2010.
siXis will be exhibiting at SC09, an international conference for high performance computing, networking, storage and analysis in Portland, Oregon, November 14-20. The company will be displaying its embedded computing modules and demonstrating its reconfigurable computing platform, the SX2000, at the conference in booth #2285.
About siXis, Inc.
siXis has created the next generation of embedded computing modules that pave the way for smaller, higher performing, scalable and lighter electronics that use less power. siXis’ patent-pending approach uses Silicon Circuit Board (SiCB) technology, which combines bare-die and packaged components on large-area silicon substrate, providing superior size, weight and power characteristics in an industry-standard BGA package.
Using a number of variations, including different CPUs, FPGAs, memory and oscillators, siXis custom embedded computing modules deliver higher performance in a smaller, energy efficient package for a diverse group of markets including communications, high-performance computing, networking, medical imaging, test and measurement, aerospace and defense.
The company, created with technology developed at RTI International, received CED’s 2008 Entrepreneurial Excellence Spin-Out of the Year Award, and is a winner of TechJournal South’s 2009 Tech 50 award. For more information, please visit www.sixisinc.com.
Contact
John Goehrke
siXis, Inc.
919-248-4112
www.sixisinc.com
info@sixisinc.com
