siXis, Inc. Launches New Identity
Semiconductor Company Previously Known as Beeco AlsoAnnounces New Website
RESEARCH TRIANGLE PARK, N.C.--October 6, 2008--siXis, Inc., a semiconductor company previously known as Beeco, Inc., announced today its new name and the launch of its new identity. The change was made to more accurately reflect the company�s focus and significant progress in the field of chip level integration. The company also announced the launch of its website, www.siXisinc.com.
“Over the past quarter we created the company, received venture funding, built our team, and shipped our first beta system,“ said John Goehrke, President and CEO of siXis. "We wanted to formally launch the company with a name and an identity that illustrates the power of our patent-pending technology: silicon connecting silicon."
The company's Silicon Circuit Board (SiCB) technology integrates packaged and unpackaged semiconductor devices on large-area silicon substrates, replacing the current method of putting packaged die onto a conventional printed circuit board. Previously, silicon circuit boards were limited to approximately one square inch while demonstrating reliability problems at larger sizes. With siXis' revolutionary technology, reliable silicon circuit boards up to 24 square inches are now possible.
Products that use siXis SiCB technology will have a significantly smaller form factor (10-to-1 reduction in area, 100-to-1 reduction in volume), exhibit higher performance, be scalable, weigh less, use less power, have higher reliability and be less expensive than products available today.
siXis will be exhibiting at SC08, an international conference for high performance computing, networking, storage, and analysis, in Austin, Texas in November. The company plans to announce its first product at the conference.
About siXis, Inc.
siXis has created the next generation of electronic component integration through its Silicon Circuit Board (SiCB) technology effectively paving the way to replace traditional fiberglass printed circuit boards (PCBs). siXis technology enables the future of high performance electronics for a diverse group of markets including the military, medical imaging, networking, geosciences, computing, biosciences, financial services and consumer electronic. The company, created with technology developed at RTI International, received CED's 2008 Entrepreneurial Excellence Spin-Out of the Year Award.
Contact
John Goehrke
siXis, Inc.
919-248-4112
www.sixisinc.com
info@sixisinc.com
