siXis Raises $3 Million Round of Financing
Semiconductor company launches new product, continues to grow business
RESEARCH TRIANGLE PARK, NC – September 29, 2009 – siXis, Inc., a company pioneering advanced Silicon Circuit Board (SiCB) technology, announced today it has raised $3 million of financing from its investors.
siXis’ existing investors, RTI International and venture capital firm Intersouth Partners, both participated in the round of financing. The investment will be used to support ongoing product development. The company recently announced the launch of the SX2000 Reconfigurable Computing Platform, a scalable, high-performance platform designed to streamline and accelerate data-intensive applications.
The company’s SiCB technology platform allows bare die integrated circuits to be densely populated onto a large area silicon substrate, replacing the current method of putting packaged die onto a conventional printed circuit board. As compared to these traditional electronic assemblies, this breakthrough platform allows a smaller overall system to deliver higher functionality and performance with reduced power requirements, due to fewer signal discontinuities and shorter traces between die.
“We’re pleased to have the continued support of our investors,” said John Goehrke, President and CEO of siXis, Inc. “With the recent launch of the SX2000 and the upcoming launch of our line of next-generation embedded computing modules, their support is critical to the continued growth of the company.”
siXis will be exhibiting at SC09, an international conference for high-performance computing, networking, storage and analysis in Portland, Oregon from November 14-20. The company will be demonstrating the SX2000, and introducing its first embedded computing modules at the conference in booth #2285.
About siXis, Inc.
siXis has created the next generation of embedded computing modules that pave the way for smaller, higher performing, scalable and lighter electronics that use less power. siXis’ patent-pending approach uses Silicon Circuit Board (SiCB) technology, which combines bare-die and packaged components on large-area silicon substrate, providing superior size, weight and power characteristics in an industry-standard BGA package.
Using a number of variations, including different CPUs, FPGAs, memory and oscillators, siXis custom embedded computing modules deliver higher performance in a smaller, energy efficient package for a diverse group of markets including communications, high-performance computing, networking, medical imaging, test and measurement, aerospace and defense.
The company, created with technology developed at RTI International, received CED’s 2008 Entrepreneurial Excellence Spin-Out of the Year Award, and is a winner of TechJournal South’s 2009 Tech 50 award. For more information, please visit www.sixisinc.com.
Contact
John Goehrke
siXis, Inc.
919-248-4112
www.sixisinc.com
info@sixisinc.com
