Through innovative thinking and the application of breakthrough technology, siXis has pioneered silicon circuit board (SiCB) technology. The result? Next-generation embedded computing modules that pave the way for smaller, higher performing, scalable, lighter, and more reliable electronics that use less power.

Our patent-pending approach to embedded computing modules employs silicon-connecting-silicon technology, lowering operating costs and improving reliability over modules fabricated with traditional electronic materials. Bare silicon die are mounted directly on large-area silicon substrates – a feat thought impossible until recent advances by siXis.

Delivering on the promise of Moore’s Law, embedded computing modules from siXis enable the future of high performance electronics for a diverse group of markets including communications, high-performance computing, networking, medical imaging, test and measurement, aerospace, and defense.